|
SECTIONS OF AUTO-WAFER MACHINE
A- KNEADING MIXER AND STORAGE SECTION
B- FLOWING DOUGH-FEEDING SECTION
C- BAKING SECTION
D- WAITING - COOLING SECTION
E- WAFER CUTTING SECTION
GENERAL SPECIFICATIONS
1. The wafer machine operates by a flowing Dough-Feeding System
(with dough being as fluid as water).
2. The ability of adjusting the product’s thinness-thickness
is in a range of 0.600 mm (600 microns) and 1,200 mm (1200 microns).
3. The feature of product obtainable from the system from the wafer
machine with 3-4 persons.
4. Depending on the requirement and thickness, the capacity and
product
manufacturing capacity in product tonnage is 1500 – 3000 kg/day.
5. By means of a disc-cutter, round or square cutting in desired
size.
6. As fuel, either LPG or Natural gas consumption.
7. Choice of having the feature of Baking through Tunnel Oven with
stainless sheet metal or wire conveyor band (biscuit type). The
heating system of the Tunnel Oven is provided by a specially designed
honey-comb type burner which turns on and has directly and manual
temperature adjustment, safety pilot system.
8. The Conveyor Band systems are made of nutrition compatible materials
(“manufacturing steel and Chrome-Nickel stainless surface
with F.D.A. Certificate”).
9. The System has a feature which allows (fast-slow) operating modes
according to the requested capacity.
10. According to the thickness adjustment, it is possible to obtain
product from type 1 and type 2 flours with 11,5-12,5 % Glutelin,
from the Auto-Wafer machine operating with flowing dough-feeding
system.
11. Easy Installation, maintenance and use.
12. Provided it is operated in compliance with the Operating Guidance,
one (1) year warranty is granted for mechanical parts, excluding
the defects of incorrect operations (Electrical-Electronic systems
are exempted).
|